{"product_id":"0-12mm-amaoe-middle-layer-bga-reballing-stencil-for-xiaomi-12pro-qualcomm-70-70mm","title":"AMAOE 0.12mm Middle Layer BGA Reballing Stencil for Xiaomi 12 Pro (Qualcomm, 70x70mm)","description":"\u003cp\u003eThe \u003cstrong\u003eAMAOE 0.12mm Middle Layer BGA Reballing Stencil\u003c\/strong\u003e is a high-precision soldering mesh engineered specifically for double-layer motherboard repair on the \u003cstrong\u003eXiaomi 12 Pro (Qualcomm Snapdragon platform)\u003c\/strong\u003e. Sized at 70 x 70 mm with an optimal 0.12mm thickness, it ensures accurate tin ball formation and seamless middle-frame reballing when reassembling sandwich logic boards.\u003c\/p\u003e\n\n\u003ch3\u003eKey Features\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\n\u003cstrong\u003ePrecise Middle Layer Reballing:\u003c\/strong\u003e Specifically designed for Xiaomi 12 Pro Qualcomm dual-layer motherboards to align all middle frame solder points perfectly.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eOptimal 0.12mm Thickness:\u003c\/strong\u003e Controls solder paste volume precisely, preventing tin bridging, uneven ball heights, or pseudo-soldering.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eLaser-Cut Square \u0026amp; Rounded Apertures:\u003c\/strong\u003e Smooth, burr-free hole walls allow effortless stencil release after heating without deforming solder balls.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eAnti-Drum Heat Resistance:\u003c\/strong\u003e High-grade imported stainless steel resists warping and bulging under direct hot-air soldering.\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eSpecifications\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\n\u003cstrong\u003eBrand:\u003c\/strong\u003e AMAOE\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eTarget Model:\u003c\/strong\u003e Xiaomi 12 Pro (Qualcomm Snapdragon Edition)\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eProduct Type:\u003c\/strong\u003e Middle Layer BGA Reballing Stencil\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eThickness:\u003c\/strong\u003e 0.12mm\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eDimensions:\u003c\/strong\u003e 70 mm x 70 mm\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eMaterial:\u003c\/strong\u003e High-Grade Japanese Stainless Steel\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eApplications\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003eXiaomi 12 Pro double-deck \/ sandwich motherboard separation and reballing\u003c\/li\u003e\n  \u003cli\u003eMiddle frame solder pad tin planting and trace restoration\u003c\/li\u003e\n  \u003cli\u003eProfessional mobile phone micro-soldering and motherboard rework\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003ePackage Includes\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e1 x AMAOE 0.12mm Middle Layer BGA Reballing Stencil (70x70mm)\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003cdiv style=\"text-align: center; margin-top: 20px;\"\u003e\n  \u003cimg src=\"https:\/\/ae-pic-a1.aliexpress-media.com\/kf\/S7e8e2278d7e442b799f839388aafe6dbR.jpg\" alt=\"AMAOE Xiaomi 12 Pro Middle Layer BGA Reballing Stencil\" style=\"max-width: 100%; height: auto;\"\u003e\n\u003c\/div\u003e","brand":"2UTOOL","offers":[{"title":"Default Title","offer_id":51286925639927,"sku":null,"price":3.72,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0954\/0816\/1015\/files\/S7e8e2278d7e442b799f839388aafe6dbR.webp?v=1791542561","url":"https:\/\/www.2utool.com\/products\/0-12mm-amaoe-middle-layer-bga-reballing-stencil-for-xiaomi-12pro-qualcomm-70-70mm","provider":"2UTOOL","version":"1.0","type":"link"}