2UTOOL
2UUL BH16 Magnetic Dual-Sided NAND Reballing Platform Set for IPhone Android EMMC Qualcomm Hisilicon NAND Flash Chip Repair Tool
2UUL BH16 Magnetic Dual-Sided NAND Reballing Platform Set for IPhone Android EMMC Qualcomm Hisilicon NAND Flash Chip Repair Tool
Verfügbarkeit für Abholungen konnte nicht geladen werden
SPECIFICATIONS
Application: Phone Repairing Tool Set
BGA Supported Sizes: BGA110, BGA315, BGA350
Brand Name: NONE
Choice: yes
DIY Supplies: Electrical
Department: Unisex-adult
High-concerned chemical: none
Material: Metal
Model Number: BH16
Origin: Mainland China
Package: Case
Pattern: Others
Platform Thickness: 0.12mm
Product Type: BGA Rework Station
Size: As Show
Type: Combination
is_customized: No
semi_Choice: yes
Dual-Sided Reballing Design
Efficiently handle both sides of the chip for faster and more precise repairs.
Ultra-Strong Magnetic Base
Ensures secure and stable fixation during reballing, preventing misalignment.
Multiple BGA Size Compatibility
Supports BGA110, BGA315, BGA350, and more for various iPhone and iPad models.
️ Ergonomic & Easy to Use
Designed for comfort and ease, reducing fatigue during prolonged repair work.
Complete Repair Kit
Comes with all necessary components for a seamless NAND reballing process.
