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2UUL DA68 Back Cover Sealant Thermal Plate for IPhone 17 Series Phone Repair Heat Conduction Pressure Tool Glue Curing
2UUL DA68 Back Cover Sealant Thermal Plate for IPhone 17 Series Phone Repair Heat Conduction Pressure Tool Glue Curing
Normaler Preis
$29.34
Normaler Preis
$29.34
Verkaufspreis
$29.34
Inkl. Steuern.
Versand wird beim Checkout berechnet
Anzahl
Verfügbarkeit für Abholungen konnte nicht geladen werden
SPECIFICATIONS
Application: Phone Repairing Tool Set
Brand Name: NONE
Choice: yes
DIY Supplies: Electrical
Department: Unisex-adult
High-concerned chemical: none
Material: Metal
Model Number: DA68
Origin: Mainland China
Package: Case
Pattern: Others
Size: As Show
Type: Combination
is_customized: No
semi_Choice: yes





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