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2UTOOL
2UUL DA68 Back Cover Sealant Thermal Plate for IPhone 17 Series Phone Repair Heat Conduction Pressure Tool Glue Curing
2UUL DA68 Back Cover Sealant Thermal Plate for IPhone 17 Series Phone Repair Heat Conduction Pressure Tool Glue Curing
Regular price
$29.34
Regular price
$29.34
Sale price
$29.34
Taxes included.
Shipping calculated at checkout.
Quantity
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SPECIFICATIONS
Application: Phone Repairing Tool Set
Brand Name: NONE
Choice: yes
DIY Supplies: Electrical
Department: Unisex-adult
High-concerned chemical: none
Material: Metal
Model Number: DA68
Origin: Mainland China
Package: Case
Pattern: Others
Size: As Show
Type: Combination
is_customized: No
semi_Choice: yes





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