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2UTOOL
2UUL DA68 Back Cover Sealant Thermal Plate for IPhone 17 Series Phone Repair Heat Conduction Pressure Tool Glue Curing
2UUL DA68 Back Cover Sealant Thermal Plate for IPhone 17 Series Phone Repair Heat Conduction Pressure Tool Glue Curing
Prix habituel
$29.34
Prix habituel
$29.34
Prix promotionnel
$29.34
Taxes incluses.
Frais d'expédition calculés à l'étape de paiement.
Quantité
Impossible de charger la disponibilité du service de retrait
SPECIFICATIONS
Application: Phone Repairing Tool Set
Brand Name: NONE
Choice: yes
DIY Supplies: Electrical
Department: Unisex-adult
High-concerned chemical: none
Material: Metal
Model Number: DA68
Origin: Mainland China
Package: Case
Pattern: Others
Size: As Show
Type: Combination
is_customized: No
semi_Choice: yes





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