Passer aux informations produits
1 de 7

2UTOOL

LANRUI CT60/CT80 Active Solder Balls 25K Micro BGA Repair Beads for IP Android Motherboard Fixing Lead-Free Welding Repair Balls

LANRUI CT60/CT80 Active Solder Balls 25K Micro BGA Repair Beads for IP Android Motherboard Fixing Lead-Free Welding Repair Balls

Prix habituel $4.00
Prix habituel $4.00 Prix promotionnel $4.00
Promotion Épuisé
Taxes incluses. Frais d'expédition calculés à l'étape de paiement.
Color
Quantité

SPECIFICATIONS

Application: Phone Repairing Tool Set

Applications: BGA Pad Repair, Motherboard Trace Fixing, Phone/Tablet PCB Restoration

Brand Name: NONE

Certification: ROHS/REACH Certified (Environmentally Safe)

Choice: yes

Compatibility: IP, Sam, HW, XM & Other Android Devices

DIY Supplies: Phone Repair

Department: Unisex-adult

Diameter Tolerance: 8 Microns (Industry-Leading Precision)

High-concerned chemical: none

Material: Metal,Lead-Free Tin Alloy (ROHS Compliant)

Model Number: LANRUI CT60 CT80

Origin: Mainland China

Package: BOX

Package Includes: 1x Active Solder Balls Bottle (Choose CT60 or CT80)

Package Quantity: 25,000 Beads/Bottle (CT60: 60μm, CT80: 80μm Options)

Pattern: Others

Size: AS Description

Storage: Anti-Static Bottle (Moisture-Proof & Oxidation-Resistant)

Type: Combination

Usage: Replace Traditional Jump Wires, Save 70% Repair Time

Yield Rate: 99.9% (Low Static Interference, High Success Rate)

is_customized: No

semi_Choice: yes

LANRUI CT60/CT80 Active Solder Balls 25K Micro BGA Repair Beads for IP Android Motherboard Fixing Lead-Free Welding Repair Balls


Afficher tous les détails