YCS 3S Fast UV Curing Solder Mask Adhesive for PCB & Motherboard Repair

The YCS 3S Fast UV Curing Solder Mask Adhesive is an essential, professional-grade solution designed for precision electronics and mobile phone motherboard micro-soldering repairs. Engineered for rapid 3-second curing under UV light, this insulating protective ink effectively shields solder joints, fixes jump wires, and repairs detached solder pads or damaged solder resist layers.

Key Features

• Ultra-Fast 3-Second Curing: Rapid polymerization under UV curing lamps drastically improves workshop efficiency.
• Superior Electrical Insulation: Delivers high dielectric strength and chemical resistance to prevent short circuits and corrosion.
• Durable Adhesion: Forms a tough, impact-resistant protective coating that will not peel, crack, or bubble during subsequent rework.
• Precision Application: Ideal viscosity for micro-dispensing on fine motherboard traces, BGA pads, and fly-wire jumper installations.

Applications

• Smartphone and logic board micro-soldering repairs.
• Insulating and securing motherboard fly-wires / jumper wires.
• Repairing peeling, scratched, or missing solder mask layers.
• Fixing BGA solder lugs and protecting surrounding components during heat rework.

Specifications

• Brand: YCS
• Model: 3S Rapid UV Curing Adhesive / Solder Mask Ink
• Curing Method: Ultraviolet (UV) Light Curing
• Curing Speed: Approx. 3 seconds (with high-power UV curing lamp)
• Net Weight: Approx. 50g