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LANRUI CT60/CT80 Active Solder Balls 25K Micro BGA Repair Beads for IP Android Motherboard Fixing Lead-Free Welding Repair Balls
LANRUI CT60/CT80 Active Solder Balls 25K Micro BGA Repair Beads for IP Android Motherboard Fixing Lead-Free Welding Repair Balls
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SPECIFICATIONS
Application: Phone Repairing Tool Set
Applications: BGA Pad Repair, Motherboard Trace Fixing, Phone/Tablet PCB Restoration
Brand Name: NONE
Certification: ROHS/REACH Certified (Environmentally Safe)
Choice: yes
Compatibility: IP, Sam, HW, XM & Other Android Devices
DIY Supplies: Phone Repair
Department: Unisex-adult
Diameter Tolerance: 8 Microns (Industry-Leading Precision)
High-concerned chemical: none
Material: Metal,Lead-Free Tin Alloy (ROHS Compliant)
Model Number: LANRUI CT60 CT80
Origin: Mainland China
Package: BOX
Package Includes: 1x Active Solder Balls Bottle (Choose CT60 or CT80)
Package Quantity: 25,000 Beads/Bottle (CT60: 60μm, CT80: 80μm Options)
Pattern: Others
Size: AS Description
Storage: Anti-Static Bottle (Moisture-Proof & Oxidation-Resistant)
Type: Combination
Usage: Replace Traditional Jump Wires, Save 70% Repair Time
Yield Rate: 99.9% (Low Static Interference, High Success Rate)
is_customized: No
semi_Choice: yes
LANRUI CT60/CT80 Active Solder Balls 25K Micro BGA Repair Beads for IP Android Motherboard Fixing Lead-Free Welding Repair Balls








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