2UUL BG01 4pcs BGA Reballing Stencil kit for iPhone 8-16 Series Nand Flash/ WIFI/Face ID /Screen /Baseband /Radio Frequency /Power Amplifier IC Repair Tin Planting Steel Mesh 

Description
2UUL BG01 ABCD BGA Reballing Stencil 4pcs/pack for iPhone 8-16 Pro Max all chips soldering and repair, including iPhone A11-A18 Pro CPU, Nand Flash chips, Baseband IC, WIFI IC, Screen IC, Face ID module, Charging port flex cable, Proximity sensor, True Tone sensor, Camera module,  Radio Frequency IC, Power Amplifier IC, and other Small ICs.

Features:
1. The stencil covers all soldering points for iPhone 8-16 series, including:
· A: CPU, NAND Flash;
· B: Baseband IC, WiFi IC;
· C: RF, amplifier, and small chips;
· D: Display, face recognition, docking station board, infrared, True Tone, and camera.
2. Includes 4 blades for enhanced ease of use and precision.
3. Precision laser cutting ensures accurate solder joint placement.
4. Improves soldering quality and reduces rework.
5. Suitable for chip-level repairs on iPhone 8 to iPhone 16 Pro Max.

Product Specifications
Name: 2UUL BG01 ABCD Reballing Stencil
Net Weight: 28g
Gross Weight: 35.4g
Dimensions: 100x85x0.1mm
Packaging Dimensions: 105x90x1.2mm