2UTOOL
2UUL DA68 Back Cover Sealant Thermal Plate for IPhone 17 Series Phone Repair Heat Conduction Pressure Tool Glue Curing
2UUL DA68 Back Cover Sealant Thermal Plate for IPhone 17 Series Phone Repair Heat Conduction Pressure Tool Glue Curing
Prezzo di listino
$29.34
Prezzo di listino
$29.34
Prezzo scontato
$29.34
Imposte incluse.
Spese di spedizione calcolate al check-out.
Quantità
Impossibile caricare la disponibilità di ritiro
SPECIFICATIONS
Application: Phone Repairing Tool Set
Brand Name: NONE
Choice: yes
DIY Supplies: Electrical
Department: Unisex-adult
High-concerned chemical: none
Material: Metal
Model Number: DA68
Origin: Mainland China
Package: Case
Pattern: Others
Size: As Show
Type: Combination
is_customized: No
semi_Choice: yes
