Back to collection
The AMAOE 0.12mm Middle Layer BGA Reballing Stencil is a high-precision soldering mesh engineered specifically for double-layer motherboard repair on the Xiaomi 12 Pro (Qualcomm Snapdragon platform). Sized at 70 x 70 mm with an optimal 0.12mm thickness, it ensures accurate tin ball formation and seamless middle-frame reballing when reassembling sandwich logic boards.
Key Features
- Precise Middle Layer Reballing: Specifically designed for Xiaomi 12 Pro Qualcomm dual-layer motherboards to align all middle frame solder points perfectly.
- Optimal 0.12mm Thickness: Controls solder paste volume precisely, preventing tin bridging, uneven ball heights, or pseudo-soldering.
- Laser-Cut Square & Rounded Apertures: Smooth, burr-free hole walls allow effortless stencil release after heating without deforming solder balls.
- Anti-Drum Heat Resistance: High-grade imported stainless steel resists warping and bulging under direct hot-air soldering.
Specifications
- Brand: AMAOE
- Target Model: Xiaomi 12 Pro (Qualcomm Snapdragon Edition)
- Product Type: Middle Layer BGA Reballing Stencil
- Thickness: 0.12mm
- Dimensions: 70 mm x 70 mm
- Material: High-Grade Japanese Stainless Steel
Applications
- Xiaomi 12 Pro double-deck / sandwich motherboard separation and reballing
- Middle frame solder pad tin planting and trace restoration
- Professional mobile phone micro-soldering and motherboard rework
Package Includes
- 1 x AMAOE 0.12mm Middle Layer BGA Reballing Stencil (70x70mm)
Why buy from 2UTOOL
Tools selected for real repair work
Clear product information, professional selection and dependable support for every purchase.
01
Professional selection
Selected around the real needs of phone and board repair.
02
Clear product information
Specifications, images and applications are presented clearly.
03
Support for your workflow
Contact us when you need product selection or volume purchasing support.