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2UTOOL

AMAOE BGA110 4-in-1 iPhone NAND Flash Magnetic Reballing Platform Kit

AMAOE BGA110 4-in-1 iPhone NAND Flash Magnetic Reballing Platform Kit

Regular price $28.01
Regular price $31.01 Sale price $28.01
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The AMAOE BGA110 4-in-1 iPhone NAND Flash Magnetic Reballing Platform Kit is specifically engineered for high-precision micro-soldering, tin scraping, and flash memory rework on Apple iPhone 8 through 11 Pro Max logic boards. Combining a heavy-duty B-S3 magnetic clamping base, heat-resistant BGA110 positioning plate, and precision Mbga-MY6 direct-heating steel mesh, it prevents chip displacement and ensures uniform solder ball heights during hot-air rework.

Key Features

  • Strong B-S3 Magnetic Clamping Base: High-temperature built-in magnets firmly secure the positioning plate and steel mesh, preventing chip shifting or lifting during hot-air heating.
  • Precision Laser Square Apertures: Engineered for BGA110 NAND footprints, guaranteeing uniform solder paste volume and effortless release without bridging.
  • Heat & Bulge Resistance: High-grade Japanese stainless steel stencil withstands direct thermal heating without deformation.
  • Modular Configuration Options: Choose between the Mbga-MY6 BGA110 Net, BGA110 Positioning Plate, B-S3 Magnetic Base, or the Complete 4-in-1 Full Set.

Specifications & Compatibility

  • Brand: AMAOE
  • Model: BGA110 4-in-1 System (Mbga-MY6 Stencil + B-S3 Base)
  • Target Memory IC: iPhone BGA110 NAND Flash (iPhone 8, 8 Plus, X, XR, XS, XS Max, 11, 11 Pro, 11 Pro Max, iPad)
  • Platform Type: B-S3 Magnetic Base + Positioning Plate + Direct-Heating Stencil
  • Application: BGA Direct Heating, Tin Scraping, NAND Flash Expansion & Repair

Available Configurations

  • Mbga-MY6 BGA110 Net: Dedicated high-precision direct-heating BGA stencil for BGA110 NAND chips.
  • BGA110 Positioning: High-temperature positioning fixture for precise NAND flash package seating.
  • B-S3 Magnetic Base: Heavy-duty magnetic platform base.
  • BGA110 4in1 Full Set: Complete toolkit including B-S3 Magnetic Base, Positioning Plate, and Mbga-MY6 Stencil.

Application & Selection

Verify your NAND flash chip size and package pinout prior to soldering. Select individual replacement parts or the complete 4-in-1 full set.




Why buy from 2UTOOL

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01

Professional selection

Selected around the real needs of phone and board repair.

02

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03

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