The AMAOE MacBook CD3215 / CD3217 USB-C Power IC Magnetic Reballing Platform Kit is engineered specifically for precision micro-soldering, tin-ball planting, and chip rework on MacBook USB-C and Thunderbolt power delivery controller ICs (including CD3215 and CD3217 series). Featuring strong magnetic adsorption and high-temperature resistant positioning, it secures chip alignment and guarantees uniform solder ball formation during hot-air rework.
Key Features
- Strong Magnetic Adsorption: Built-in high-temperature magnets in the B-1 base provide solid clamping force to prevent stencil and chip displacement during heating.
- High-Precision Laser Square Holes: Apertures prevent solder bridging and ensure uniform solder ball volume with clean, effortless paste release.
- Heat-Resistant Positioning Plate: Withstands direct thermal airflow without warping or bulging, keeping the delicate IC securely centered.
- Modular & Flexible Setup: Available as individual components (stencil, positioning plate, base) or as a comprehensive full set.
Specifications & Compatibility
- Brand: AMAOE
- Target ICs: CD3215, CD3217 (MacBook USB-C Type-C / Thunderbolt 3 Power Delivery Controllers)
- Compatible Devices: Apple MacBook Pro and MacBook Air Logic Boards
- Platform Type: Magnetic BGA Reballing Base & Stencil System
- Application: BGA IC Direct Heating, Tin Planting, Micro-Soldering Rework
Available Configurations
- Stencil: Dedicated precision BGA reballing steel stencil for CD3215/CD3217 ICs.
- Positioning: High-temperature positioning plate for accurate chip seating.
- B-1 Magnetic Base: Solid magnetic base platform for stable desktop soldering.
- Full Set: Includes B-1 Magnetic Base, Positioning Plate, and Stencil for a complete rework station.
Application & Selection
Verify the IC model marking and motherboard layout before selecting components. Individual parts or the complete full set can be chosen depending on your repair bench requirements.






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