AMAOE Multi-Series Smartphone & Tablet BGA Reballing Stencil Sets (0.12mm)

The AMAOE Multi-Series Smartphone & Tablet BGA Reballing Stencil collection is a comprehensive 0.12mm precision direct-heating steel mesh system covering major mobile logic board architectures. Providing complete series bundles for iPhone, iPad, MacBook, Samsung, Xiaomi, Huawei, OPPO, VIVO, Qualcomm, and MediaTek chipsets, each stencil set features precision square apertures and heat-resistant Japanese steel for effortless paste release and uniform solder ball formation.

Key Features

• Complete Brand & Platform Coverage: Full curated sets dedicated to Apple (iPhone, iPad, MacBook), Samsung Exynos, Qualcomm Snapdragon, MediaTek Dimensity/Helio, Huawei HiSilicon, Xiaomi, and OPPO/VIVO.
• Precision Laser Square Apertures: Engineered with laser-cut square holes to prevent solder bridging and ensure uniform solder ball volume across high-density IC matrices.
• Thermal Warping & Bulge Resistance: High-grade 0.12mm Japanese stainless steel withstands direct hot-air soldering without distortion or pin misalignment.
• Chemically Polished Smooth Walls: Allows smooth solder paste application and effortless stencil separation without disturbing freshly formed solder balls.

Specifications

• Brand: AMAOE
• Thickness: 0.12mm (Precision Direct Heating)
• Material: Heat-Resistant Japanese Stainless Steel
• Supported Ecosystems: Apple iOS/macOS, Samsung, Xiaomi, Huawei, OPPO, VIVO, Qualcomm, MediaTek
• Application: Smartphone, Tablet & Laptop BGA Direct Heating, Tin Ball Planting, Logic Board Rework

Available Series Bundles

• iPhone (iP6-18, 13 Pcs): Covers iPhone 6 through modern series logic board ICs.
• iPad Series (11 Pcs): Dedicated templates for iPad logic boards and power management.
• MacBook Series (MAC1-13, 13 Pcs): Comprehensive MacBook CPU, RAM, and controller coverage.
• Samsung (SAM1-23, 23 Pcs) & Exynos (EU1-5, 5 Pcs): Full Galaxy series and Exynos processor coverage.
• Qualcomm (QU1-9, 9 Pcs & MQ1-6, 6 Pcs): Flagship Snapdragon processors and baseband chipsets.
• MediaTek (MU1-6, 6 Pcs): Dimensity and Helio processor series.
• Xiaomi (Mi1-19, 19 Pcs) & OPPO/VIVO (OV1-9, 9 Pcs): Motherboard sets for leading Android brands.
• Huawei (HW1-18, 18 Pcs; HU1-4, 4 Pcs; HI1-2, 2 Pcs): Complete HiSilicon Kirin and auxiliary IC coverage.
• Multifunction Set (2 Pcs): Universal arrays for common SMD and power IC rework.

Application & Selection

Select your brand and device family bundle from the options. Match your specific chip markings with the designated stencil in each set before soldering.