Amaoe Magnetic BGA Reballing Platform Kit for Nintendo Switch Tegra X1 CPU (ODNX02-A2)

The Amaoe Magnetic BGA Reballing Platform Kit for Nintendo Switch is a dedicated micro-soldering station engineered specifically for Nintendo Switch processor rework. Tailored for the Nvidia Tegra X1 CPU (ODNX02-A2), it pairs a powerful magnetic clamping base with a precision positioning plate and high-grade steel stencil to deliver exact solder ball formation and effortless IC reflow.

Key Features

• Dedicated Switch CPU Alignment: Custom-machined positioning plate tailored specifically for the Nvidia Tegra X1 (ODNX02-A2) processor footprint.
• Strong Magnetic Clamping: Heavy-duty magnetic fixture locks stencils securely flat against the chip, eliminating paste leakage and stencil shifting.
• Direct Heating Resistance: Japanese heat-resistant stainless steel allows direct hot air reflow without bulging, distortion, or warping.
• Laser-Cut Chamfered Apertures: Precision-etched square openings promote smooth solder ball release and prevent solder bridging.
• Thermal Expansion Relief: Anti-drumming grooves distribute heat evenly to prevent stencil warpage and protect sensitive silicon dies.

Specifications

• Brand: Amaoe
• Compatible Processor: Nintendo Switch Nvidia Tegra X1 (ODNX02-A2)
• Stencil Thickness: 0.2mm
• Material: Japanese Heat-Resistant Stainless Steel & Synthetic Magnetic Base
• Application: Console CPU BGA Tin Planting / Reballing

Applications & Compatibility

• Compatible with Nintendo Switch consoles (V1, V2, Switch Lite, and Switch OLED models).
• Ideal for CPU replacement, blue-screen/orange-screen error repairs, and processor desoldering/reballing.

Available Configurations

• Full Set 1 / Full Set 2: Complete packages including magnetic base, Tegra X1 positioning board, and stencil.
• ODNX02-A2 Stencil: Precision reballing steel mesh only.
• Position Board: Dedicated Tegra X1 CPU chip alignment positioning plate.
• Magnetic Base: Magnetic fixture clamping base only.