Amaoe QU1-QU8 Qualcomm Snapdragon CPU BGA Reballing Stencil Set

The Amaoe QU1–QU8 Qualcomm Snapdragon CPU BGA Reballing Stencil Set is a specialized collection of precision tin-planting templates engineered for Qualcomm mobile processors. Designed for smartphone motherboard repair, CPU/RAM rework, and chip replacement, it covers mainstream Qualcomm MSM, SDM, and SM series chipsets with micron-level alignment accuracy.

Key Features

• Precision Laser Apertures: High-density square holes with rounded corners ensure smooth solder paste release and uniform ball formation without bridging.
• Anti-Bulging Heat Resistance: Precision-cut thermal relief grooves prevent steel mesh warping and deformation under direct hot-air gun heating.
• Extensive Snapdragon Coverage: Supports a wide spectrum of Qualcomm mobile processors from legacy MSM to modern flagship SM series.
• Standard 0.12mm Thickness: Ensures consistent solder ball height for micro-pitch BGA packages and stacked memory configurations.

Specifications

• Brand: Amaoe
• Series: QU Series (QU1 through QU8)
• Compatible Processors: Qualcomm Snapdragon MSM, SDM, and SM Series
• Thickness: 0.12mm
• Product Type: BGA Reballing Stencils
• Material: Heat-Resistant Japanese Stainless Steel

Configuration & Selection Guidance

• QU1-8 (8-Piece Set): Complete workshop collection containing all 8 QU stencils (QU1 through QU8) for full repair versatility.
• QU 1 to QU 8 (Single Stencils): Individual stencils targeted at specific Qualcomm processor families and ball arrays.
• Please verify the CPU part number (e.g., SM8250, SM8350, SDM845) laser-etched on your chip package before ordering individual stencils.

Package Includes

• 1 x Selected Amaoe QU Stencil (Individual Stencil or Complete 8-Piece Set)