AMAOE STM32F407IEH6 BGA201 Magnetic Reballing Platform

Direct-heating stencil and magnetic platform system designed for STMicroelectronics STM32F407IEH6 microcontroller BGA rework.

Application and Selection

Engineered specifically for STMicroelectronics STM32F407 series microcontrollers in the high-density UFBGA176+25 (BGA201) 10x10mm package. Widely used in industrial automation, flight controllers, 3D printer motherboards, and embedded IoT systems. Stencils, positioning plates, and magnetic bases are offered individually or as a complete kit; verify your selected configuration below before placing your order.

Product Details

The Amaoe STM32F407IEH6 BGA201 Magnetic Reballing Platform provides micrometer-accurate alignment and rock-solid magnetic clamping for embedded MCU repair. Constructed with high-temperature synthetic stone positioning fixtures and laser-cut stainless steel stencils, it ensures precise solder ball formation and prevents chip movement or stencil bulging during direct hot-air soldering.

Key Features

• Magnetic Precision Clamping: High-adsorption magnetic base firmly secures the positioning plate and stencil, eliminating micro-slippage during tin paste application and heating.
• Synthetic Stone Fixture: Premium synthetic stone positioning plate withstands continuous thermal rework without warping, degrading, or transferring thermal stress to the MCU.
• Precision Laser-Cut BGA201 Stencil: Micro-radiused square apertures provide clean solder paste release, uniform solder ball formation, and zero bridging across dense 201-ball arrays.
• Dedicated IC Package Pocket: Precision CNC-milled recess perfectly seats UFBGA176+25 dimensions, ensuring exact pin-to-pad alignment.
• Anti-Bulging Thermal Relief: Stencil design incorporates thermal expansion channels to remain completely flat under direct hot-air torch heating.

Configuration & Package Options

• Full Set: Includes the magnetic fixture base, dedicated STM32F407IEH6 synthetic stone positioning plate, and direct-heating BGA stencil.
• Positioning Plate: Synthetic stone positioning plate specifically milled for BGA201 / UFBGA176+25 MCU packages.
• BGA Stencil: High-precision laser-cut stainless steel reballing mesh only.
• Magnetic Base: Dedicated magnetic fixture platform base only.

Specifications

• Brand: Amaoe
• Compatible Chipset: STMicroelectronics STM32F407IEH6
• Package Standard: UFBGA176+25 (BGA201, 10x10mm)
• Materials: Synthetic Stone & High-Grade Japanese Stainless Steel
• Application: Embedded MCU repair, industrial control board rework, and BGA reballing