Overview
The AMAOE Steam Deck IC BGA Reballing Stencil is precision-engineered for motherboard and chip-level repair on the Valve Steam Deck handheld console. Designed for direct heating, it facilitates accurate solder ball placement and reliable rework on critical power, control, audio, and memory ICs.
Key Features
- Precision Laser-Cut Openings: Ensures uniform solder ball formation and alignment, minimizing bridging and cold solder joints.
- Direct Heating Design: Heat-resistant stainless steel construction withstands direct hot air rework without warping or deformation.
- Multi-IC Coverage: Dedicated patterns designed specifically for major onboard ICs used in Steam Deck repair.
Specifications & Compatibility
- Compatible Device: Valve Steam Deck Motherboard
- Supported ICs: MPSP16 (PMIC), ANX7580 (Display/USB-C), 77958 (Power Delivery), CS35L41B (Audio Amp), K3LKBKB0BM (LPDDR5), and IT5570VG-128 (EC)
- Material: High-grade stainless steel
- Type: Direct Heating BGA Reballing Stencil
Selection & Usage Guidance
Always verify the chip part number, package dimensions, and solder-ball pitch against your target component before reballing. Preheat the board evenly and apply controlled hot air to ensure smooth solder reflow and maintain stencil durability.
Why buy from 2UTOOL
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Selected around the real needs of phone and board repair.
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