AMAOE Exynos 1480 S5E8845 BGA Stencil, 0.12mm

Magnetic 0.12mm stencil for the listed Samsung Exynos 1480 S5E8845 CPU layout.

Application and selection

Use the chip marking, package dimensions and solder-ball pattern to select a compatible stencil. A shared phone or computer series name alone does not establish a matching layout.

Product details

The Amaoe Magnetic BGA Reballing Stencil for Samsung Exynos 1480 (S5E8845) is an ultra-precise 0.12mm micro-soldering steel mesh tailored for Samsung smartphone motherboard repair. Designed to support magnetic positioning platforms and direct hot air heating, it provides clean, uniform solder ball alignment for Samsung Exynos processors and stacked memory chips.

Key Features

• Custom Exynos 1480 Pinout: Specifically engineered for Samsung S5E8845 / Exynos 1480 CPU and RAM BGA solder pad geometry.
• Magnetic Platform Compatible: Works seamlessly with magnetic tin planting bases to prevent stencil shifting during solder paste scraping.
• Direct Heating Resistance: Fabricated from Japanese high-temperature alloy steel, resisting thermal warpage and bulging under direct heat gun reflow.
• Precision Laser Etched: Smooth, burr-free square apertures with chamfered inner walls facilitate clean solder ball release and prevent bridging.
• Engineered Heat Relief: Thermal expansion venting minimizes stress and prevents chip distortion during rework.

Specifications

• Brand: Amaoe
• Compatible Chipset: Samsung Exynos 1480 (S5E8845)
• Thickness: 0.12mm
• Material: Japanese Heat-Resistant Stainless Steel
• Application: CPU & RAM BGA Reballing / Tin Planting

Applications & Compatibility

• Compatible with Samsung smartphones powered by the Exynos 1480 processor (such as Samsung Galaxy A55 5G).
• Ideal for CPU reballing, RAM chip separation, motherboard failure recovery, and micro-soldering repairs.

Package Includes

• 1 x Amaoe BGA Reballing Stencil for Samsung Exynos 1480 (0.12mm)