Amaoe U13 SM7350 Snapdragon CPU Magnetic BGA Reballing Platform Kit

The Amaoe U13 SM7350 Snapdragon CPU Magnetic BGA Reballing Platform Kit is an industrial-grade tin-planting rework station engineered specifically for Qualcomm SM7350 (Snapdragon 775 / 778G series) mobile processors. Designed for Android smartphone motherboard repair, CPU replacement, and RAM stacking rework, it combines heat-resistant synthetic stone and powerful magnetic clamping for micron-precise solder ball alignment.

Key Features

• Strong Magnetic Clamping: High-flux neodymium magnets firmly lock the positioning plate and stencil in place, eliminating micro-shifts during solder paste scraping.
• Anti-Bulging 0.12mm Stencil: Laser-etched square apertures with rounded corners ensure clean solder ball release and resist heat deformation under direct hot air.
• Thermal-Insulating Synthetic Stone: High-temperature composite material resists thermal sink effects and protects sensitive CPU dies from excessive heat stress.
• Modular Flexibility: Choose individual components (stencil, positioning plate, base) or a complete full kit based on your benchtop setup.

Specifications

• Brand: Amaoe
• Model: U13 Platform
• Compatible Processor: Qualcomm SM7350 (Snapdragon 775 / 778G Series)
• Stencil Thickness: 0.12mm
• Product Type: BGA Reballing Platforms
• Material: Synthetic Stone & Magnetic Stainless Steel Base

Configuration & Selection Guidance

• Full Set: Includes the universal magnetic base, dedicated U13 SM7350 positioning plate, and matching BGA stencil.
• Position plate: Includes 1x dedicated synthetic stone CPU positioning plate only.
• magnet base: Includes 1x universal magnetic base fixture only.
• Stencil: Includes 1x dedicated 0.12mm BGA planting steel mesh stencil only.
• Please confirm that your target processor reads SM7350 before purchasing individual components.

Package Includes

• 1 x Selected Amaoe U13 SM7350 Reballing Platform Component (according to purchased variant)