AMAOE Universal Magnetic BGA Reballing Platform & Base Fixture for Phone Motherboard & IC Repair

The AMAOE Universal Magnetic BGA Reballing Platform & Fixture Base is an indispensable precision tool for professional micro-soldering, smartphone motherboard middle-frame bonding, and BGA chip reballing. Designed with strong built-in magnets and high-temperature resistant materials, it firmly secures your positioning plates and reballing stencils in place, preventing shifting or thermal warping during hot-air rework.

Key Features

• High-Strength Magnetic Positioning: Integrated powerful neodymium magnets ensure strong adsorption and stable stencil clamping without accidental sliding.
• Heat & Wear Resistant: Engineered with premium high-temperature synthetic stone and durable alloy components to withstand intense hot-air rework without deforming.
• Universal Precision Alignment: Compatible with AMAOE middle-frame positioning stencils, CPU stencils, and universal IC tin-planting fixtures for iPhone and Android logic boards.
• Smooth & Flat Working Surface: CNC-machined surface ensures uniform heat distribution and consistent solder ball formation across micro-BGA components.
• Ergonomic & Compact: Streamlined low-profile footprint fits comfortably under stereo microscopes and soldering workstations.

Configuration Options

• Full Set: Complete fixture setup including the magnetic base plate and compatible positioning accessories.
• 4 Magnetic Base: 4-point magnetic platform base providing reinforced holding power for larger middle-frame stencils.
• 3 Magnetic Base: 3-point magnetic base configuration optimized for compact logic board and IC stencil setups.

Technical Specifications

• Brand: AMAOE
• Product Type: Universal Magnetic BGA Reballing Platform / Fixture Base
• Application: Smartphone motherboard middle frame, CPU, NAND, and IC micro-soldering rework
• Material: High-temperature synthetic stone & precision magnetic alloy

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