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2UTOOL

JCID SC-02 Precision Non-Magnetic Solder Scraper Tool Set for BGA Reballing & Phone Repair

JCID SC-02 Precision Non-Magnetic Solder Scraper Tool Set for BGA Reballing & Phone Repair

Regular price $6.38
Regular price $7.38 Sale price $6.38
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Overview

The JCID SC-02 Precision Non-Magnetic Solder Scraper Set is engineered specifically for micro-soldering professionals and smartphone logic board technicians. Designed to deliver smooth, scratch-free solder removal and tin paste application, this 2-piece scraper set protects delicate BGA stencils and PCB pads while ensuring optimal cleanliness during reballing and micro-rework procedures.

Key Features

  • Non-Magnetic Stainless Steel: Forged from high-grade non-magnetic stainless steel to prevent magnetic interference and eliminate unwanted attraction of tin balls, metal shavings, or microscopic debris.
  • Stencil & Pad Protection: Precision-ground blade profile glides effortlessly across BGA reballing stencils and circuit boards without scratching stencil mesh or lifting delicate solder pads.
  • Dual-Size 2-Piece Set: Includes two distinct blade widths with ergonomic handles (blue and black) to accommodate both compact microscopic chips and broad IC reballing surfaces.
  • Clean & Contamination-Free Repairs: Prevents secondary metal contamination across high-density circuit boards, ensuring reliable solder joint formation.
  • Durable & Rust-Resistant: Premium build quality withstands repeated exposure to flux, solvents, and cleaning agents without corrosion or edge deformation.

Specifications & Compatibility

  • Brand: JCID
  • Model: SC-02
  • Material: Premium Non-Magnetic Stainless Steel + Ergonomic Handle
  • Package Contents: 2 PCS Solder Scraper Set (Dual-Size Blades)
  • Primary Applications: BGA reballing solder paste scraping, solder residue leveling, stencil cleaning, and motherboard IC pad preparation.
  • Device Compatibility: Universal for iPhone, iPad, Android devices, laptops, and precision electronics repair.

Usage & Maintenance Guidance

  • Select the narrow blade for fine-pitch ICs, small SMD components, and intricate BGA stencil openings.
  • Select the wider blade for fast, uniform solder paste leveling across CPU, NAND, and power IC reballing stencils.
  • Clean blades with isopropyl alcohol (IPA) after each use to keep scraping edges clean and maintain peak reballing accuracy.

Why buy from 2UTOOL

Tools selected for real repair work

Clear product information, professional selection and dependable support for every purchase.

01

Professional selection

Selected around the real needs of phone and board repair.

02

Clear product information

Specifications, images and applications are presented clearly.

03

Support for your workflow

Contact us when you need product selection or volume purchasing support.