JTX SM-01 New Upgrade Swap Master Chip Reballing Fixture Platform for IPhone 8-16PM Series Motherboard CPU Repair Stencil Kit

JTX SM-01 New Upgrade Swap Master Chip Reballing Fixture Platform for IPhone 8-16PM Series Motherboard CPU Repair Stencil Kit
JTX SM-01 Series Chip Reballing Platform with Stencil Kits
Professional-Grade Tool for iPhone and BGA Chip Repairs!

Key Features:
 Universal Compatibility: Perfectly supports iPhone 8 to iPhone 16 series and other BGA chips (CPU/GPU/memory).
 Precision Alignment: Adjustable platform with clamps ensures flawless chip positioning during reballing.
 Multi-Stencil Kit: Includes templates for various chip sizes (0.2mm to 0.5mm ball sizes).
 Heat-Resistant Design: Durable aluminum alloy withstands high temperatures during soldering.
 Easy Operation: Streamlined workflow for beginners and professionals alike.

️ Technical Advantages:

• Anti-Slip Base: Stabilizes the device during delicate operations.

• Modular Design: Swap stencils quickly for different repair tasks.

• Ergonomic Clamps: Secure chips without damaging delicate components.

How to Use:

1. Setup: Attach the appropriate stencil to the platform.

2. Alignment: Secure the iPhone logic board using clamps.

3. Reballing: Apply solder balls through the stencil and reflow with a hot air station.

4. Cleanup: Use included tools to remove excess solder or residue.

Specifications:

• Weight: 850g (Platform) | 1.2kg (Total)

• Stencil Material: Stainless Steel

Why Choose JTX SM-01?

• Time-Saving: Reduce reballing errors with precise alignment.

• Cost-Effective: Replace damaged chips instead of entire boards.

• Durable: Built to last with industrial-grade materials.