Overview
The LANRUI G4 Magnetic Motherboard Layer Separator is a professional micro-soldering fixture engineered for layered logic board splitting and EMI shield can removal. Designed specifically for multi-tier double-decker smartphone motherboards, it utilizes high-strength, heat-tolerant magnetic attraction paired with a 360° rotatable full-metal handle to provide vertical, balanced lifting force during heating, preventing torn solder pads and tin explosion.
Key Features
- Strong Magnetic Vertical Lifting: High-grade neodymium magnet provides strong, consistent lifting force, pulling upper boards and shield covers vertically without uneven lateral stress.
- Explosion-Proof & Pad Protection: Controlled separation prevents solder ball splashing, bridged interposer pads, and board warping during high-temperature desoldering.
- 360° Rotatable Metal Handle: Ergonomic CNC-machined metal handle rotates smoothly for precise fingertip maneuvering and microscope-friendly clearance.
- High-Temperature Durability: Heat-resistant magnetic assembly and all-metal construction endure continuous exposure to heating platforms and hot air rework stations.
- Wide Application: Ideal for iPhone layered motherboards, Android sandwiched logic boards, and precision RF shield can removal.
Specifications & Compatibility
- Brand: LANRUI
- Model: G4
- Material: CNC Machined Aviation Aluminum & High-Strength Permanent Magnet
- Operation: 360° Rotatable Manual Handle with Magnetic Adsorption
- Compatibility: Compatible with iPhone dual-layer motherboards (iPhone X through 15/16 series), Android multi-layer logic boards, and steel/copper shield cans
Operating Guidance & Best Practices
- Preheating: Place the layered motherboard onto a dedicated heating platform and allow the solder joint interposer to reach melting temperature before lifting.
- Positioning: Align the magnetic lifter centrally over the upper board or shield cover to distribute magnetic pull evenly.
- Vertical Separation: Gently lift straight up once the solder melts; do not use excessive force before the middle-frame solder reflows completely.
- Maintenance: Keep the magnetic contact face clean and free from loose solder balls and metallic dust to maintain maximum suction.
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